Epoxy Molding Compound (EMC) for semiconductors is a thermosetting material specially used for semiconductor packaging, which plays a key role in the semiconductor industry. It can wrap semiconductor chips, provide physical protection for the chips, and ensure stable and reliable electrical connections between the chips and external circuits.

EMC is mainly composed of epoxy resin, curing agent, filler, additives and other ingredients. Epoxy resin is its basic ingredient. It has good adhesion and mechanical properties and can form a solid protective shell after curing. The curing agent reacts chemically with the epoxy resin to cause the material to change from liquid to solid and achieve curing and molding. Fillers usually use inorganic materials such as silica. The addition of a large amount of fillers can effectively reduce material costs, while enhancing its mechanical strength, reducing the thermal expansion coefficient, improving the thermal matching between EMC and chip and substrate materials, and reducing chip damage caused by thermal stress. Additives include release agents, flame retardants, colorants, etc. Release agents facilitate the smooth removal of products from molds after molding; flame retardants can improve the flame retardant properties of materials, ensuring that they are not easy to burn when encountering abnormal conditions during the use of electronic products, ensuring safe use; colorants give materials specific colors to facilitate product identification and classification.

In terms of characteristics, EMC has excellent electrical insulation performance, which can effectively isolate the chip from external electrical interference and ensure the normal operation of the chip. Its good mechanical strength can withstand various external force impacts during packaging, transportation and use, protecting the chip from physical damage. At the same time, EMC has high thermal stability, and can maintain stable performance at different operating temperatures, avoiding performance degradation due to temperature changes, and ensuring that the chip can work reliably under various environmental conditions. In addition, it also has low hygroscopicity, which reduces problems such as electrical performance degradation and material expansion caused by moisture absorption, and improves product reliability.

In the field of semiconductor packaging, EMC is widely used. In traditional lead frame packaging, it is used to fix the chip on the lead frame and form a protective shell to achieve electrical connection between the chip and the external pins. This packaging form is often used for low-end chips in consumer electronics, automotive electronics and other fields. In advanced ball grid array (BGA) and chip scale packaging (CSP) packaging technologies, EMC also plays an important role. It can meet the strict requirements of these high-precision packages on material performance and ensure that the chip can still work stably in a smaller package size. It is widely used in the core chip packaging of high-end electronic products such as smartphones and computers.

As semiconductor technology develops towards miniaturization and high performance, higher requirements are also placed on the performance of EMC. In the future, EMC will continue to optimize performance and develop towards lower thermal expansion coefficient, higher thermal conductivity, better fluidity and higher reliability. R&D personnel will improve the formula and process, develop new epoxy resins and additives, and further improve the performance of EMC under extreme conditions to meet the needs of semiconductor packaging for emerging technologies such as 5G communications, artificial intelligence, and the Internet of Things.

Report Scope
This report aims to deliver a thorough analysis of the global market for Epoxy Molding Compound (EMC) for Semiconductor, offering both quantitative and qualitative insights to assist readers in formulating business growth strategies, evaluating the competitive landscape, understanding their current market position, and making well-informed decisions regarding Epoxy Molding Compound (EMC) for Semiconductor.

The report is enriched with qualitative evaluations, including market drivers, challenges, Porter’s Five Forces, regulatory frameworks, consumer preferences, and ESG (Environmental, Social, and Governance) factors.

The report provides detailed classification of Epoxy Molding Compound (EMC) for Semiconductor, such as type, etc.; detailed examples of Epoxy Molding Compound (EMC) for Semiconductor applications, such as application one, etc., and provides comprehensive historical (2020-2025) and forecast (2026-2031) market size data.

The report provides detailed classification of Epoxy Molding Compound (EMC) for Semiconductor, such as Standard (Halogen Free) Epoxy Molding Compound, Little Warpage Epoxy Molding Compound, High Thermal Epoxy Molding Compound, etc.; detailed examples of Epoxy Molding Compound (EMC) for Semiconductor applications, such as Lead Frame (DIS and DIP), Substrate (BGA and CSP), Power Devices, etc., and provides comprehensive historical (2020-2025) and forecast (2026-2031) market size data.

The report covers key global regions—North America, Europe, Asia-Pacific, Latin America, and the Middle East & Africa—providing granular, country-specific insights for major markets such as the United States, China, Germany, and Brazil.

The report deeply explores the competitive landscape of Epoxy Molding Compound (EMC) for Semiconductor products, details the sales, revenue, and regional layout of some of the world's leading manufacturers, and provides in-depth company profiles and contact details.

The report contains a comprehensive industry chain analysis covering raw materials, downstream customers and sales channels.

Core Chapters

Chapter One: Introduces the study scope of this report, market status, market drivers, challenges, porters five forces analysis, regulatory policy, consumer preference, market attractiveness and ESG analysis.

Chapter Two: market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter Three: Epoxy Molding Compound (EMC) for Semiconductor market sales and revenue in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.

Chapter Four: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter Five: Detailed analysis of Epoxy Molding Compound (EMC) for Semiconductor manufacturers competitive landscape, price, sales, revenue, market share, footprint, merger, and acquisition information, etc.

Chapter Six: Provides profiles of leading manufacturers, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction.

Chapter Seven: Analysis of industrial chain, key raw materials, customers and sales channel.

Chapter Eight: Key Takeaways and Final Conclusions

Chapter Nine: Methodology and Sources.

1 Epoxy Molding Compound (EMC) for Semiconductor Market Overview and Qualitative Analysis
1.1 Epoxy Molding Compound (EMC) for Semiconductor Product Definition and Statistical Scope
1.2 Epoxy Molding Compound (EMC) for Semiconductor Market Status and Outlook
1.2.1 Epoxy Molding Compound (EMC) for Semiconductor Market Revenue Estimates and Forecasts 2020-2031
1.2.2 Epoxy Molding Compound (EMC) for Semiconductor Market Sales Estimates and Forecasts 2020-2031
1.3 Epoxy Molding Compound (EMC) for Semiconductor Market Driver Analysis
1.4 Epoxy Molding Compound (EMC) for Semiconductor Market Challenges Analysis
1.5 Porter's Five Forces Analysis
1.5.1 Bargaining Power of Suppliers
1.5.2 Bargaining Power of Buyers/Consumers
1.5.3 Threat of New Entrants
1.5.4 Threat of Substitute Products
1.5.5 Intensity of Competitive Rivalry
1.6 Regulatory Policy Analysis
1.7 Consumer Preference Analysis
1.8 Market Attractiveness Analysis
1.9 ESG (Environmental, Social and Governance) Analysis
2 Epoxy Molding Compound (EMC) for Semiconductor Market Type Estimates & Trend Analysis
2.1 Epoxy Molding Compound (EMC) for Semiconductor Type Dashboard
2.2 Epoxy Molding Compound (EMC) for Semiconductor Market by Type
2.2.1 Standard (Halogen Free) Epoxy Molding Compound
2.2.2 Little Warpage Epoxy Molding Compound
2.2.3 High Thermal Epoxy Molding Compound
2.3 Global Epoxy Molding Compound (EMC) for Semiconductor Market Size by Type
2.3.1 Historical Analysis of the Global Epoxy Molding Compound (EMC) for Semiconductor Market Size by Type (2020-2025)
2.3.2 Projected Analysis of Global Epoxy Molding Compound (EMC) for Semiconductor Market Size by Type (2026–2031)
3 Epoxy Molding Compound (EMC) for Semiconductor Market Geography Estimates & Trend Analysis
3.1 Epoxy Molding Compound (EMC) for Semiconductor Geography Dashboard
3.2 Global Epoxy Molding Compound (EMC) for Semiconductor Historic Market Size by Region
3.2.1 Global Epoxy Molding Compound (EMC) for Semiconductor Market Sales by Region (2020-2025)
3.2.2 Global Epoxy Molding Compound (EMC) for Semiconductor Market Revenue by Region (2020-2025)
3.3 Global Epoxy Molding Compound (EMC) for Semiconductor Forecasted Market Size by Region
3.3.1 Global Epoxy Molding Compound (EMC) for Semiconductor Market Sales by Region (2026-2031)
3.3.2 Global Epoxy Molding Compound (EMC) for Semiconductor Market Revenue by Region (2026-2031)
3.4 North America Epoxy Molding Compound (EMC) for Semiconductor Market by Country
3.4.1 North America Epoxy Molding Compound (EMC) for Semiconductor Market Sales by Country (2020-2031)
3.4.2 North America Epoxy Molding Compound (EMC) for Semiconductor Market Revenue by Country (2020-2031)
3.4.3 United States Epoxy Molding Compound (EMC) for Semiconductor Market Sales, Revenue and Growth Rate (2020-2031)
3.4.4 Canada Epoxy Molding Compound (EMC) for Semiconductor Market Sales, Revenue and Growth Rate (2020-2031)
3.5 Europe Epoxy Molding Compound (EMC) for Semiconductor Market by Country
3.5.1 Europe Epoxy Molding Compound (EMC) for Semiconductor Market Sale by Country (2020-2031)
3.5.2 Europe Epoxy Molding Compound (EMC) for Semiconductor Market Revenue by Country (2020-2031)
3.5.3 Germany Market Sales, Revenue and Growth Rate (2020-2031)
3.5.4 France Market Sales, Revenue and Growth Rate (2020-2031)
3.5.5 U.K. Market Sales, Revenue and Growth Rate (2020-2031)
3.5.6 Italy Market Sales, Revenue and Growth Rate (2020-2031)
3.5.7 Spain Market Sales, Revenue and Growth Rate (2020-2031)
3.6 Asia-Pacific Epoxy Molding Compound (EMC) for Semiconductor Market by Region
3.6.1 Asia-Pacific Epoxy Molding Compound (EMC) for Semiconductor Market Sales by Region (2020-2031)
3.6.2 Asia-Pacific Epoxy Molding Compound (EMC) for Semiconductor Market Revenue by Region (2020-2031)
3.6.3 China Market Sales, Revenue and Growth Rate (2020-2031)
3.6.4 Japan Market Sales, Revenue and Growth Rate (2020-2031)
3.6.5 South Korea Market Sales, Revenue and Growth Rate (2020-2031)
3.6.6 India Market Sales, Revenue and Growth Rate (2020-2031)
3.6.7 Southeast Asia Market Sales, Revenue and Growth Rate (2020-2031)
3.7 Latin America Epoxy Molding Compound (EMC) for Semiconductor Market by Country
3.7.1 Latin America Epoxy Molding Compound (EMC) for Semiconductor Market Sales by Country (2020-2031)
3.7.2 Latin America Epoxy Molding Compound (EMC) for Semiconductor Market Revenue by Country (2020-2031)
3.7.3 Mexico Market Sales, Revenue and Growth Rate (2020-2031)
3.7.4 Brazil Market Sales, Revenue and Growth Rate (2020-2031)
3.8 Middle East and Africa Epoxy Molding Compound (EMC) for Semiconductor Market by Country
3.8.1 Middle East and Africa Epoxy Molding Compound (EMC) for Semiconductor Market Sales by Country (2020-2031)
3.8.2 Middle East and Africa Epoxy Molding Compound (EMC) for Semiconductor Market Revenue by Country (2020-2031)
3.8.3 Turkey Market Sales, Revenue and Growth Rate (2020-2031)
3.8.4 Saudi Arabia Market Sales, Revenue and Growth Rate (2020-2031)
3.8.5 South Africa Market Sales, Revenue and Growth Rate (2020-2031)
4 Epoxy Molding Compound (EMC) for Semiconductor Market Application Estimates & Trend Analysis
4.1 Epoxy Molding Compound (EMC) for Semiconductor Market Application Dashboard
4.2 Epoxy Molding Compound (EMC) for Semiconductor Market by Application
4.2.1 Lead Frame (DIS and DIP)
4.2.2 Substrate (BGA and CSP)
4.2.3 Power Devices
4.3 Global Epoxy Molding Compound (EMC) for Semiconductor Market Size by Application
4.3.1 Historical Analysis of Global Epoxy Molding Compound (EMC) for Semiconductor Market Size by Application (2020-2025)
4.3.2 Projected Analysis of Global Epoxy Molding Compound (EMC) for Semiconductor Market Size by Application (2026-2031)
5 Epoxy Molding Compound (EMC) for Semiconductor Market Competitive Landscape Analysis
5.1 Global Epoxy Molding Compound (EMC) for Semiconductor Leading Manufacturers’ Market Sales Performance and Share Analysis
5.2 Global Epoxy Molding Compound (EMC) for Semiconductor Leading Manufacturers’ Market Revenue Performance and Share Analysis
5.3 Global Epoxy Molding Compound (EMC) for Semiconductor Leading Manufacturers’ Average Sales Price (2020-2025)
5.4 Global Epoxy Molding Compound (EMC) for Semiconductor Leading Manufacturers’ Regional Footprint (Headquarters, Manufacturing Base and Sales Ares)
5.5 Mergers and Acquisition Analysis
6 Leading Manufacturers’ Company Profiles
6.1 Sumitomo Bakelite
6.1.1 Sumitomo Bakelite Overview (Basic Corporate Information, Manufacturing Footprint, Geographic Sales Presence and Key Competitors)
6.1.2 Sumitomo Bakelite Introduction and Business Overview
6.1.3 Sumitomo Bakelite Epoxy Molding Compound (EMC) for Semiconductor Product Portfolio
6.1.4 Sumitomo Bakelite Epoxy Molding Compound (EMC) for Semiconductor Market Performance Analysis (Revenue, Sales, Price, Gross Margin and Market Share)
6.2 Hitachi Chemical
6.2.1 Hitachi Chemical Overview (Basic Corporate Information, Manufacturing Footprint, Geographic Sales Presence and Key Competitors)
6.2.2 Hitachi Chemical Introduction and Business Overview
6.2.3 Hitachi Chemical Epoxy Molding Compound (EMC) for Semiconductor Product Portfolio
6.2.4 Hitachi Chemical Epoxy Molding Compound (EMC) for Semiconductor Market Performance Analysis (Revenue, Sales, Price, Gross Margin and Market Share)
6.3 Chang Chun Group
6.3.1 Chang Chun Group Overview (Basic Corporate Information, Manufacturing Footprint, Geographic Sales Presence and Key Competitors)
6.3.2 Chang Chun Group Introduction and Business Overview
6.3.3 Chang Chun Group Epoxy Molding Compound (EMC) for Semiconductor Product Portfolio
6.3.4 Chang Chun Group Epoxy Molding Compound (EMC) for Semiconductor Market Performance Analysis (Revenue, Sales, Price, Gross Margin and Market Share)
6.4 Hysol Huawei Electronics
6.4.1 Hysol Huawei Electronics Overview (Basic Corporate Information, Manufacturing Footprint, Geographic Sales Presence and Key Competitors)
6.4.2 Hysol Huawei Electronics Introduction and Business Overview
6.4.3 Hysol Huawei Electronics Epoxy Molding Compound (EMC) for Semiconductor Product Portfolio
6.4.4 Hysol Huawei Electronics Epoxy Molding Compound (EMC) for Semiconductor Market Performance Analysis (Revenue, Sales, Price, Gross Margin and Market Share)
6.5 Panasonic
6.5.1 Panasonic Overview (Basic Corporate Information, Manufacturing Footprint, Geographic Sales Presence and Key Competitors)
6.5.2 Panasonic Introduction and Business Overview
6.5.3 Panasonic Epoxy Molding Compound (EMC) for Semiconductor Product Portfolio
6.5.4 Panasonic Epoxy Molding Compound (EMC) for Semiconductor Market Performance Analysis (Revenue, Sales, Price, Gross Margin and Market Share)
6.6 Kyocera
6.6.1 Kyocera Overview (Basic Corporate Information, Manufacturing Footprint, Geographic Sales Presence and Key Competitors)
6.6.2 Kyocera Introduction and Business Overview
6.6.3 Kyocera Epoxy Molding Compound (EMC) for Semiconductor Product Portfolio
6.6.4 Kyocera Epoxy Molding Compound (EMC) for Semiconductor Market Performance Analysis (Revenue, Sales, Price, Gross Margin and Market Share)
6.7 KCC
6.7.1 KCC Overview (Basic Corporate Information, Manufacturing Footprint, Geographic Sales Presence and Key Competitors)
6.7.2 KCC Introduction and Business Overview
6.7.3 KCC Epoxy Molding Compound (EMC) for Semiconductor Product Portfolio
6.7.4 KCC Epoxy Molding Compound (EMC) for Semiconductor Market Performance Analysis (Revenue, Sales, Price, Gross Margin and Market Share)
6.8 Samsung SDI
6.8.1 Samsung SDI Overview (Basic Corporate Information, Manufacturing Footprint, Geographic Sales Presence and Key Competitors)
6.8.2 Samsung SDI Introduction and Business Overview
6.8.3 Samsung SDI Epoxy Molding Compound (EMC) for Semiconductor Product Portfolio
6.8.4 Samsung SDI Epoxy Molding Compound (EMC) for Semiconductor Market Performance Analysis (Revenue, Sales, Price, Gross Margin and Market Share)
6.9 Eternal Materials
6.9.1 Eternal Materials Overview (Basic Corporate Information, Manufacturing Footprint, Geographic Sales Presence and Key Competitors)
6.9.2 Eternal Materials Introduction and Business Overview
6.9.3 Eternal Materials Epoxy Molding Compound (EMC) for Semiconductor Product Portfolio
6.9.4 Eternal Materials Epoxy Molding Compound (EMC) for Semiconductor Market Performance Analysis (Revenue, Sales, Price, Gross Margin and Market Share)
6.10 Jiangsu Zhongpeng New Material
6.10.1 Jiangsu Zhongpeng New Material Overview (Basic Corporate Information, Manufacturing Footprint, Geographic Sales Presence and Key Competitors)
6.10.2 Jiangsu Zhongpeng New Material Introduction and Business Overview
6.10.3 Jiangsu Zhongpeng New Material Epoxy Molding Compound (EMC) for Semiconductor Product Portfolio
6.10.4 Jiangsu Zhongpeng New Material Epoxy Molding Compound (EMC) for Semiconductor Market Performance Analysis (Revenue, Sales, Price, Gross Margin and Market Share)
6.11 Shin-Etsu Chemical
6.11.1 Shin-Etsu Chemical Overview (Basic Corporate Information, Manufacturing Footprint, Geographic Sales Presence and Key Competitors)
6.11.2 Shin-Etsu Chemical Introduction and Business Overview
6.11.3 Shin-Etsu Chemical Epoxy Molding Compound (EMC) for Semiconductor Product Portfolio
6.11.4 Shin-Etsu Chemical Epoxy Molding Compound (EMC) for Semiconductor Market Performance Analysis (Revenue, Sales, Price, Gross Margin and Market Share)
6.12 Hexion
6.12.1 Hexion Overview (Basic Corporate Information, Manufacturing Footprint, Geographic Sales Presence and Key Competitors)
6.12.2 Hexion Introduction and Business Overview
6.12.3 Hexion Epoxy Molding Compound (EMC) for Semiconductor Product Portfolio
6.12.4 Hexion Epoxy Molding Compound (EMC) for Semiconductor Market Performance Analysis (Revenue, Sales, Price, Gross Margin and Market Share)
6.13 Nepes
6.13.1 Nepes Overview (Basic Corporate Information, Manufacturing Footprint, Geographic Sales Presence and Key Competitors)
6.13.2 Nepes Introduction and Business Overview
6.13.3 Nepes Epoxy Molding Compound (EMC) for Semiconductor Product Portfolio
6.13.4 Nepes Epoxy Molding Compound (EMC) for Semiconductor Market Performance Analysis (Revenue, Sales, Price, Gross Margin and Market Share)
6.14 Tianjin Kaihua Insulating Material
6.14.1 Tianjin Kaihua Insulating Material Overview (Basic Corporate Information, Manufacturing Footprint, Geographic Sales Presence and Key Competitors)
6.14.2 Tianjin Kaihua Insulating Material Introduction and Business Overview
6.14.3 Tianjin Kaihua Insulating Material Epoxy Molding Compound (EMC) for Semiconductor Product Portfolio
6.14.4 Tianjin Kaihua Insulating Material Epoxy Molding Compound (EMC) for Semiconductor Market Performance Analysis (Revenue, Sales, Price, Gross Margin and Market Share)
6.15 HHCK
6.15.1 HHCK Overview (Basic Corporate Information, Manufacturing Footprint, Geographic Sales Presence and Key Competitors)
6.15.2 HHCK Introduction and Business Overview
6.15.3 HHCK Epoxy Molding Compound (EMC) for Semiconductor Product Portfolio
6.15.4 HHCK Epoxy Molding Compound (EMC) for Semiconductor Market Performance Analysis (Revenue, Sales, Price, Gross Margin and Market Share)
6.16 Scienchem
6.16.1 Scienchem Overview (Basic Corporate Information, Manufacturing Footprint, Geographic Sales Presence and Key Competitors)
6.16.2 Scienchem Introduction and Business Overview
6.16.3 Scienchem Epoxy Molding Compound (EMC) for Semiconductor Product Portfolio
6.16.4 Scienchem Epoxy Molding Compound (EMC) for Semiconductor Market Performance Analysis (Revenue, Sales, Price, Gross Margin and Market Share)
6.17 Beijing Sino-tech Electronic Material
6.17.1 Beijing Sino-tech Electronic Material Overview (Basic Corporate Information, Manufacturing Footprint, Geographic Sales Presence and Key Competitors)
6.17.2 Beijing Sino-tech Electronic Material Introduction and Business Overview
6.17.3 Beijing Sino-tech Electronic Material Epoxy Molding Compound (EMC) for Semiconductor Product Portfolio
6.17.4 Beijing Sino-tech Electronic Material Epoxy Molding Compound (EMC) for Semiconductor Market Performance Analysis (Revenue, Sales, Price, Gross Margin and Market Share)
7 Industry Chain Analysis
7.1 Upstream Key Raw Materials
7.1.1 Raw Materials A Definition and Suppliers
7.1.2 Raw Materials B Definition and Suppliers
7.1.3 Raw Materials C Definition and Suppliers
7.2 Epoxy Molding Compound (EMC) for Semiconductor Typical Downstream Customers
7.3 Epoxy Molding Compound (EMC) for Semiconductor Sales Channel Analysis
8 Key Takeaways and Final Conclusions
9 Methodology and Sources
9.1 Research Methodology
9.2 Data Mining
9.2.1 Preliminary Data Sources
9.2.2 Secondary Sources
9.3 Industry Analysis Matrix
9.4 Disclaimer

Table 1. Epoxy Molding Compound (EMC) for Semiconductor Market Driver Analysis
Table 2. Epoxy Molding Compound (EMC) for Semiconductor Market Challenges Analysis
Table 3. Epoxy Molding Compound (EMC) for Semiconductor Regulatory Policy Analysis
Table 4. Epoxy Molding Compound (EMC) for Semiconductor Consumer Preference Analysis
Table 5. Epoxy Molding Compound (EMC) for Semiconductor Market Attractiveness Analysis
Table 6. Epoxy Molding Compound (EMC) for Semiconductor ESG Analysis
Table 7. Global Epoxy Molding Compound (EMC) for Semiconductor Market Revenue by Type: 2020 VS 2024 VS 2031
Table 8. Global Epoxy Molding Compound (EMC) for Semiconductor Market Sales by Type (2020-2025)
Table 9. Global Epoxy Molding Compound (EMC) for Semiconductor Market Sales Share by Type (2020-2025)
Table 10. Global Epoxy Molding Compound (EMC) for Semiconductor Market Revenue by Type (2020-2025)
Table 11. Global Epoxy Molding Compound (EMC) for Semiconductor Market Revenue Share by Type (2020-2025)
Table 12. Global Epoxy Molding Compound (EMC) for Semiconductor Market Price by Type (2020-2025)
Table 13. Global Epoxy Molding Compound (EMC) for Semiconductor Market Sales by Type (2026-2031)
Table 14. Global Epoxy Molding Compound (EMC) for Semiconductor Market Sales Share by Type (2026-2031)
Table 15. Global Epoxy Molding Compound (EMC) for Semiconductor Market Revenue by Type (2026-2031)
Table 16. Global Epoxy Molding Compound (EMC) for Semiconductor Market Revenue Share by Type (2026-2031)
Table 17. Global Epoxy Molding Compound (EMC) for Semiconductor Market Price by Type (2026-2031)
Table 18. Global Epoxy Molding Compound (EMC) for Semiconductor Market Size Comparison by Region: 2020 VS 2024 VS 2031
Table 19. Global Epoxy Molding Compound (EMC) for Semiconductor Market Sales by Region (2020-2025)
Table 20. Global Epoxy Molding Compound (EMC) for Semiconductor Market Sales Share by Region (2020-2025)
Table 21. Global Epoxy Molding Compound (EMC) for Semiconductor Market Revenue by Region (2020-2025)
Table 22. Global Epoxy Molding Compound (EMC) for Semiconductor Market Revenue Share by Region (2020-2025)
Table 23. Global Epoxy Molding Compound (EMC) for Semiconductor Market Sales by Region (2026-2031)
Table 24. Global Epoxy Molding Compound (EMC) for Semiconductor Market Sales Share in Volume by Region (2026-2031)
Table 25. Global Epoxy Molding Compound (EMC) for Semiconductor Market Revenue by Region (2026-2031)
Table 26. Global Epoxy Molding Compound (EMC) for Semiconductor Market Revenue Share by Region (2026-2031)
Table 27. North America Epoxy Molding Compound (EMC) for Semiconductor Market Sales by Country (2020-2025)
Table 28. North America Epoxy Molding Compound (EMC) for Semiconductor Market Sales by Country (2026-2031)
Table 29. North America Epoxy Molding Compound (EMC) for Semiconductor Market Revenue by Country (2020-2025)
Table 30. North America Epoxy Molding Compound (EMC) for Semiconductor Market Revenue by Country (2026-2031)
Table 31. Europe Epoxy Molding Compound (EMC) for Semiconductor Market Sales by Country (2020-2025)
Table 32. Europe Epoxy Molding Compound (EMC) for Semiconductor Market Sales by Country (2026-2031)
Table 33. Europe Epoxy Molding Compound (EMC) for Semiconductor Market Revenue by Country (2020-2025)
Table 34. Europe Epoxy Molding Compound (EMC) for Semiconductor Market Revenue by Country (2026-2031)
Table 35. Asia-Pacific Epoxy Molding Compound (EMC) for Semiconductor Market Sales by Region (2020-2025)
Table 36. Asia-Pacific Epoxy Molding Compound (EMC) for Semiconductor Market Sales by Region (2026-2031)
Table 37. Asia-Pacific Epoxy Molding Compound (EMC) for Semiconductor Market Revenue by Region (2020-2025)
Table 38. Asia-Pacific Epoxy Molding Compound (EMC) for Semiconductor Market Revenue by Region (2026-2031)
Table 39. Latin America Epoxy Molding Compound (EMC) for Semiconductor Market Sales by Country (2020-2025)
Table 40. Latin America Epoxy Molding Compound (EMC) for Semiconductor Market Sales by Country (2026-2031)
Table 41. Latin America Epoxy Molding Compound (EMC) for Semiconductor Market Revenue by Country (2020-2025)
Table 42. Latin America Epoxy Molding Compound (EMC) for Semiconductor Market Revenue by Country (2026-2031)
Table 43. Middle East and Africa Epoxy Molding Compound (EMC) for Semiconductor Market Sales by Country (2020-2025)
Table 44. Middle East and Africa Epoxy Molding Compound (EMC) for Semiconductor Market Sales by Country (2026-2031)
Table 45. Middle East and Africa Epoxy Molding Compound (EMC) for Semiconductor Market Revenue by Country (2020-2025)
Table 46. Middle East and Africa Epoxy Molding Compound (EMC) for Semiconductor Market Revenue by Country (2026-2031)
Table 47. Global Epoxy Molding Compound (EMC) for Semiconductor Market Revenue by Application: 2020 VS 2024 VS 2031
Table 48. Global Epoxy Molding Compound (EMC) for Semiconductor Market Sales by Application (2020-2025)
Table 49. Global Epoxy Molding Compound (EMC) for Semiconductor Market Sales Share by Application (2020-2025)
Table 50. Global Epoxy Molding Compound (EMC) for Semiconductor Market Revenue by Application (2020-2025)
Table 51. Global Epoxy Molding Compound (EMC) for Semiconductor Market Revenue Share by Application (2020-2025)
Table 52. Global Epoxy Molding Compound (EMC) for Semiconductor Market Price by Application (2020-2025)
Table 53. Global Epoxy Molding Compound (EMC) for Semiconductor Market Sales by Application (2026-2031)
Table 54. Global Epoxy Molding Compound (EMC) for Semiconductor Market Sales Share by Application (2026-2031)
Table 55. Global Epoxy Molding Compound (EMC) for Semiconductor Market Revenue by Application (2026-2031)
Table 56. Global Epoxy Molding Compound (EMC) for Semiconductor Market Revenue Share by Application (2026-2031)
Table 57. Global Epoxy Molding Compound (EMC) for Semiconductor Market Price by Application (2026-2031)
Table 58. Global Epoxy Molding Compound (EMC) for Semiconductor Leading Manufacturers’ Market Sales Performance
Table 59. Global Epoxy Molding Compound (EMC) for Semiconductor Leading Manufacturers’ Market Sales Share
Table 60. Global Epoxy Molding Compound (EMC) for Semiconductor Leading Manufacturers’ Market Revenue Performance (2020-2025)
Table 61. Global Epoxy Molding Compound (EMC) for Semiconductor Leading Manufacturers’ Market Revenue Share (2020-2025)
Table 62. Global Epoxy Molding Compound (EMC) for Semiconductor Leading Manufacturers’ Average Sales Price (2020-2025)
Table 63. Global Epoxy Molding Compound (EMC) for Semiconductor Leading Manufacturers’ Regional Footprint (Headquarters, Manufacturing Base and Sales Areas)
Table 64. Mergers and Acquisition Analysis
Table 65. Sumitomo Bakelite Overview (Basic Corporate Information, Manufacturing Footprint, Geographic Sales Presence and Key Competitors)
Table 66. Sumitomo Bakelite Introduction and Business Overview
Table 67. Sumitomo Bakelite Epoxy Molding Compound (EMC) for Semiconductor Product
Table 68. Sumitomo Bakelite Epoxy Molding Compound (EMC) for Semiconductor Sales, Revenue, Price, Gross Margin and Market Share (2020-2025)
Table 69. Hitachi Chemical Overview (Basic Corporate Information, Manufacturing Footprint, Geographic Sales Presence and Key Competitors)
Table 70. Hitachi Chemical Introduction and Business Overview
Table 71. Hitachi Chemical Epoxy Molding Compound (EMC) for Semiconductor Product
Table 72. Hitachi Chemical Epoxy Molding Compound (EMC) for Semiconductor Sales, Revenue, Price, Gross Margin and Market Share (2020-2025)
Table 73. Chang Chun Group Overview (Basic Corporate Information, Manufacturing Footprint, Geographic Sales Presence and Key Competitors)
Table 74. Chang Chun Group Introduction and Business Overview
Table 75. Chang Chun Group Epoxy Molding Compound (EMC) for Semiconductor Product
Table 76. Chang Chun Group Epoxy Molding Compound (EMC) for Semiconductor Sales, Revenue, Price, Gross Margin and Market Share (2020-2025)
Table 77. Hysol Huawei Electronics Overview (Basic Corporate Information, Manufacturing Footprint, Geographic Sales Presence and Key Competitors)
Table 78. Hysol Huawei Electronics Introduction and Business Overview
Table 79. Hysol Huawei Electronics Epoxy Molding Compound (EMC) for Semiconductor Product
Table 80. Hysol Huawei Electronics Epoxy Molding Compound (EMC) for Semiconductor Sales, Revenue, Price, Gross Margin and Market Share (2020-2025)
Table 81. Panasonic Overview (Basic Corporate Information, Manufacturing Footprint, Geographic Sales Presence and Key Competitors)
Table 82. Panasonic Introduction and Business Overview
Table 83. Panasonic Epoxy Molding Compound (EMC) for Semiconductor Product
Table 84. Panasonic Epoxy Molding Compound (EMC) for Semiconductor Sales, Revenue, Price, Gross Margin and Market Share (2020-2025)
Table 85. Kyocera Overview (Basic Corporate Information, Manufacturing Footprint, Geographic Sales Presence and Key Competitors)
Table 86. Kyocera Introduction and Business Overview
Table 87. Kyocera Epoxy Molding Compound (EMC) for Semiconductor Product
Table 88. Kyocera Epoxy Molding Compound (EMC) for Semiconductor Sales, Revenue, Price, Gross Margin and Market Share (2020-2025)
Table 89. KCC Overview (Basic Corporate Information, Manufacturing Footprint, Geographic Sales Presence and Key Competitors)
Table 90. KCC Introduction and Business Overview
Table 91. KCC Epoxy Molding Compound (EMC) for Semiconductor Product
Table 92. KCC Epoxy Molding Compound (EMC) for Semiconductor Sales, Revenue, Price, Gross Margin and Market Share (2020-2025)
Table 93. Samsung SDI Overview (Basic Corporate Information, Manufacturing Footprint, Geographic Sales Presence and Key Competitors)
Table 94. Samsung SDI Introduction and Business Overview
Table 95. Samsung SDI Epoxy Molding Compound (EMC) for Semiconductor Product
Table 96. Samsung SDI Epoxy Molding Compound (EMC) for Semiconductor Sales, Revenue, Price, Gross Margin and Market Share (2020-2025)
Table 97. Eternal Materials Overview (Basic Corporate Information, Manufacturing Footprint, Geographic Sales Presence and Key Competitors)
Table 98. Eternal Materials Introduction and Business Overview
Table 99. Eternal Materials Epoxy Molding Compound (EMC) for Semiconductor Product
Table 100. Eternal Materials Epoxy Molding Compound (EMC) for Semiconductor Sales, Revenue, Price, Gross Margin and Market Share (2020-2025)
Table 101. Jiangsu Zhongpeng New Material Overview (Basic Corporate Information, Manufacturing Footprint, Geographic Sales Presence and Key Competitors)
Table 102. Jiangsu Zhongpeng New Material Introduction and Business Overview
Table 103. Jiangsu Zhongpeng New Material Epoxy Molding Compound (EMC) for Semiconductor Product
Table 104. Jiangsu Zhongpeng New Material Epoxy Molding Compound (EMC) for Semiconductor Sales, Revenue, Price, Gross Margin and Market Share (2020-2025)
Table 105. Shin-Etsu Chemical Overview (Basic Corporate Information, Manufacturing Footprint, Geographic Sales Presence and Key Competitors)
Table 106. Shin-Etsu Chemical Introduction and Business Overview
Table 107. Shin-Etsu Chemical Epoxy Molding Compound (EMC) for Semiconductor Product
Table 108. Shin-Etsu Chemical Epoxy Molding Compound (EMC) for Semiconductor Sales, Revenue, Price, Gross Margin and Market Share (2020-2025)
Table 109. Hexion Overview (Basic Corporate Information, Manufacturing Footprint, Geographic Sales Presence and Key Competitors)
Table 110. Hexion Introduction and Business Overview
Table 111. Hexion Epoxy Molding Compound (EMC) for Semiconductor Product
Table 112. Hexion Epoxy Molding Compound (EMC) for Semiconductor Sales, Revenue, Price, Gross Margin and Market Share (2020-2025)
Table 113. Nepes Overview (Basic Corporate Information, Manufacturing Footprint, Geographic Sales Presence and Key Competitors)
Table 114. Nepes Introduction and Business Overview
Table 115. Nepes Epoxy Molding Compound (EMC) for Semiconductor Product
Table 116. Nepes Epoxy Molding Compound (EMC) for Semiconductor Sales, Revenue, Price, Gross Margin and Market Share (2020-2025)
Table 117. Tianjin Kaihua Insulating Material Overview (Basic Corporate Information, Manufacturing Footprint, Geographic Sales Presence and Key Competitors)
Table 118. Tianjin Kaihua Insulating Material Introduction and Business Overview
Table 119. Tianjin Kaihua Insulating Material Epoxy Molding Compound (EMC) for Semiconductor Product
Table 120. Tianjin Kaihua Insulating Material Epoxy Molding Compound (EMC) for Semiconductor Sales, Revenue, Price, Gross Margin and Market Share (2020-2025)
Table 121. HHCK Overview (Basic Corporate Information, Manufacturing Footprint, Geographic Sales Presence and Key Competitors)
Table 122. HHCK Introduction and Business Overview
Table 123. HHCK Epoxy Molding Compound (EMC) for Semiconductor Product
Table 124. HHCK Epoxy Molding Compound (EMC) for Semiconductor Sales, Revenue, Price, Gross Margin and Market Share (2020-2025)
Table 125. Scienchem Overview (Basic Corporate Information, Manufacturing Footprint, Geographic Sales Presence and Key Competitors)
Table 126. Scienchem Introduction and Business Overview
Table 127. Scienchem Epoxy Molding Compound (EMC) for Semiconductor Product
Table 128. Scienchem Epoxy Molding Compound (EMC) for Semiconductor Sales, Revenue, Price, Gross Margin and Market Share (2020-2025)
Table 129. Beijing Sino-tech Electronic Material Overview (Basic Corporate Information, Manufacturing Footprint, Geographic Sales Presence and Key Competitors)
Table 130. Beijing Sino-tech Electronic Material Introduction and Business Overview
Table 131. Beijing Sino-tech Electronic Material Epoxy Molding Compound (EMC) for Semiconductor Product
Table 132. Beijing Sino-tech Electronic Material Epoxy Molding Compound (EMC) for Semiconductor Sales, Revenue, Price, Gross Margin and Market Share (2020-2025)
Table 133. Raw Materials A Key Suppliers Lists
Table 134. Raw Materials B Key Suppliers Lists
Table 135. Raw Materials C Key Suppliers Lists
Table 136. Epoxy Molding Compound (EMC) for Semiconductor Typical Downstream Customers
Table 137. Research Programs/Design for This Report
Figure 1. Epoxy Molding Compound (EMC) for Semiconductor Product Picture
Figure 2. Global Epoxy Molding Compound (EMC) for Semiconductor Market Size, 2020 VS 2024 VS 2031
Figure 3. Global Epoxy Molding Compound (EMC) for Semiconductor Market Size Status and Outlook (2020-2031)
Figure 4. Global Epoxy Molding Compound (EMC) for Semiconductor Sales Status and Outlook (2020-2031)
Figure 5. Epoxy Molding Compound (EMC) for Semiconductor Porter's Five Forces Analysis Picture
Figure 6. Global Epoxy Molding Compound (EMC) for Semiconductor Market Revenue by Type (2020-2031)
Figure 7. Global Epoxy Molding Compound (EMC) for Semiconductor Market Revenue Share by Type in 2024 & 2031
Figure 8. Product Picture of Standard (Halogen Free) Epoxy Molding Compound
Figure 9. Global Standard (Halogen Free) Epoxy Molding Compound Revenue and Growth Rate (2020-2031)
Figure 10. Product Picture of Little Warpage Epoxy Molding Compound
Figure 11. Global Little Warpage Epoxy Molding Compound Revenue and Growth Rate (2020-2031)
Figure 12. Product Picture of High Thermal Epoxy Molding Compound
Figure 13. Global High Thermal Epoxy Molding Compound Revenue and Growth Rate (2020-2031)
Figure 14. United States Epoxy Molding Compound (EMC) for Semiconductor Market Sales and Growth Rate (2020-2031)
Figure 15. United States Epoxy Molding Compound (EMC) for Semiconductor Market Revenue and Growth Rate (2020-2031)
Figure 16. Canada Epoxy Molding Compound (EMC) for Semiconductor Market Sales and Growth Rate (2020-2031)
Figure 17. Canada Epoxy Molding Compound (EMC) for Semiconductor Market Revenue and Growth Rate (2020-2031)
Figure 18. Germany Epoxy Molding Compound (EMC) for Semiconductor Market Sales and Growth Rate (2020-2031)
Figure 19. Germany Epoxy Molding Compound (EMC) for Semiconductor Market Revenue and Growth Rate (2020-2031)
Figure 20. France Epoxy Molding Compound (EMC) for Semiconductor Market Sales and Growth Rate (2020-2031)
Figure 21. France Epoxy Molding Compound (EMC) for Semiconductor Market Revenue and Growth Rate (2020-2031)
Figure 22. U.K. Epoxy Molding Compound (EMC) for Semiconductor Market Sales and Growth Rate (2020-2031)
Figure 23. U.K. Epoxy Molding Compound (EMC) for Semiconductor Market Revenue and Growth Rate (2020-2031)
Figure 24. Italy Epoxy Molding Compound (EMC) for Semiconductor Market Sales and Growth Rate (2020-2031)
Figure 25. Italy Epoxy Molding Compound (EMC) for Semiconductor Market Revenue and Growth Rate (2020-2031)
Figure 26. Spain Epoxy Molding Compound (EMC) for Semiconductor Market Sales and Growth Rate (2020-2031)
Figure 27. Spain Epoxy Molding Compound (EMC) for Semiconductor Market Revenue and Growth Rate (2020-2031)
Figure 28. China Epoxy Molding Compound (EMC) for Semiconductor Market Sales and Growth Rate (2020-2031)
Figure 29. China Epoxy Molding Compound (EMC) for Semiconductor Market Revenue and Growth Rate (2020-2031)
Figure 30. Japan Epoxy Molding Compound (EMC) for Semiconductor Market Sales and Growth Rate (2020-2031)
Figure 31. Japan Epoxy Molding Compound (EMC) for Semiconductor Market Revenue and Growth Rate (2020-2031)
Figure 32. South Korea Epoxy Molding Compound (EMC) for Semiconductor Market Sales and Growth Rate (2020-2031)
Figure 33. South Korea Epoxy Molding Compound (EMC) for Semiconductor Market Revenue and Growth Rate (2020-2031)
Figure 34. India Epoxy Molding Compound (EMC) for Semiconductor Market Sales and Growth Rate (2020-2031)
Figure 35. India Epoxy Molding Compound (EMC) for Semiconductor Market Revenue and Growth Rate (2020-2031)
Figure 36. Southeast Asia Epoxy Molding Compound (EMC) for Semiconductor Market Sales and Growth Rate (2020-2031)
Figure 37. Southeast Asia Epoxy Molding Compound (EMC) for Semiconductor Market Revenue and Growth Rate (2020-2031)
Figure 38. Mexico Epoxy Molding Compound (EMC) for Semiconductor Market Sales and Growth Rate (2020-2031)
Figure 39. Mexico Epoxy Molding Compound (EMC) for Semiconductor Market Revenue and Growth Rate (2020-2031)
Figure 40. Brazil Epoxy Molding Compound (EMC) for Semiconductor Market Sales and Growth Rate (2020-2031)
Figure 41. Brazil Epoxy Molding Compound (EMC) for Semiconductor Market Revenue and Growth Rate (2020-2031)
Figure 42. Turkey Epoxy Molding Compound (EMC) for Semiconductor Market Sales and Growth Rate (2020-2031)
Figure 43. Turkey Epoxy Molding Compound (EMC) for Semiconductor Market Revenue and Growth Rate (2020-2031)
Figure 44. Saudi Arabia Epoxy Molding Compound (EMC) for Semiconductor Market Sales and Growth Rate (2020-2031)
Figure 45. Saudi Arabia Epoxy Molding Compound (EMC) for Semiconductor Market Revenue and Growth Rate (2020-2031)
Figure 46. South Africa Epoxy Molding Compound (EMC) for Semiconductor Market Sales and Growth Rate (2020-2031)
Figure 47. South Africa Epoxy Molding Compound (EMC) for Semiconductor Market Revenue and Growth Rate (2020-2031)
Figure 48. Global Epoxy Molding Compound (EMC) for Semiconductor Market Revenue by Application (2020-2031)
Figure 49. Global Epoxy Molding Compound (EMC) for Semiconductor Revenue Market Share by Application in 2024 & 2031
Figure 50. Product Picture of Lead Frame (DIS and DIP)
Figure 51. Global Lead Frame (DIS and DIP) Revenues YoY Growth (2020-2031)
Figure 52. Product Picture of Substrate (BGA and CSP)
Figure 53. Global Substrate (BGA and CSP) Revenues YoY Growth (2020-2031)
Figure 54. Product Picture of Power Devices
Figure 55. Global Power Devices Revenues YoY Growth (2020-2031)
Figure 56. Epoxy Molding Compound (EMC) for Semiconductor Channels of Distribution (Direct Vs Distribution)